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集邦咨询：英伟达2025年推Blackwell Ultra、B200A，将拉升HBM3e 12hi消耗比重至40%
8月8日，金十数据报道，根据TrendForce集邦咨询的最新HBM报告，随着AI芯片的迭代，单个芯片搭载的HBM（高带宽内存）容量也明显增加。NVIDIA（英伟达）目前是HBM市场的最大买家，预计在2025年推出Blackwell Ultra、B200A等产品后，其在HBM市场的采购比重将突破70%。